The Fodel? photo defined thick film ceramic system, featuring dielectric, silver and gold conductors, combines the best and most cost-effective photolithography processes used in electronics today with the performance and reliability of thick film ceramics. The resulting combination enables the creation of high density/fine line/fine geometry circuits, ideal for the most challenging applications and toughest operating environments, all while keeping production costs low.
Because they don’t require dedicated processing equipment, Fodel? compositions are very cost-effective. The compositions respond to ultra-violet (UV) light at around 400 nanometers (similar to liquid photo imageable (LPI) solder mask, or other primary imaging systems) and can be imaged in either collimated or non-collimated exposure units.
The Fodel? system, designed for aqueous-based development, is compatible with standard (UV wavelength response) circuit board production processes, for easy incorporation. The sintering process is also designed for standard production processes; after photo defining the circuit, it can be fired in standard ceramic thick film furnaces in 30 or 60 minute profiles at 850OC.